Solutions for Process Integration

EXCICO LTA is an ultrafast and low thermal budget process, involving sub µs timescales for temperature and species evolution.With these unique features, LTA is a highly scalable process, which can be adapted...

Excico Laser Annealing

The ultra-low thermal budget processes enabled by the Excico annealing equipments are covering a wide range of semiconductor markets for present and future device generations...

POWER DEVICES with less process steps and better performance Backside junction formation can now be done at end-of-line with no adverse impact on completed nMOS and pMOS devices on the front side, ILDs, Buffer...

CMOS Imaging Sensor with top-class S/N ratio Laser Backside junction formation avoids costly epi layer and improve device performance by melt and sub-melt mediated dopant activation process Fill factor brought to 100%...

CMOS Logic Ultra Shallow Junction formation with high activation rate Source and Drain junction formation using low thermal budget, high surface temperature and diffusion less process...

The photovoltaic industry is fast developing with a CAGR of 40% over the past 10 years (1999-2008), reaching 5.6GW in shipments in 2008. However after the 2009 global crisis and following market consolidation...