Solutions for Process Integration

EXCICO LTA is an ultrafast and low thermal budget process, involving sub µs timescales for temperature and species evolution.With these unique features, LTA is a highly scalable process, which can be adapted for next generation devices and technologies.Using up-to-date knowledge over a large span of technologies and processes, EXCICO provides a unique service for integrating LTA in your current process flow and in next generation device design.Thanks to realistic and predictive simulations, we can help you design optimized layer stacks, geometries and process conditions to fully benefit from the unique features provided by the LTA process.

• 1D & 2D simulations
• Melt and recrystallization front evolution
• Time dependent temperature evolution to ensure integrity of low temperature layers
• Dopant diffusion for junction profile engineering
• Parametric studies for process window determination

Backside Illuminated CMOS Imaging Sensor structure: Snapshot of 2D temperature profile during LTA process of Backside structure