The key to uniform intra-device process result is our optical system providing top-hat homogeneity over the whole exposed area. A portfolio of optical solutions is available to respond to the specific needs of each application:

• Standard Exposure: full wafer exposure enabling the highest productivity, especially adapted to power devices applications
• With Full Device Exposure (FDE^TM), Excico offers the only solution where the annealed area can be matched and aligned to the device geometry, enabling an overlap-free process critical for products such as Back Side Illuminated CMOS Imaging Sensors (BSI-CIS) or Memory Devices.