Excico releases its next FDE generation
Excico releases the latest features of its FDETM (Full Device Exposure) technology.
The technology enables to anneal a single device in a single laser shot exposure and was originally released to the market in 2009.
The latest developments include a specific pattern recognition system that improves the capability to anneal higher field factor in the die by enhancing positioning accuracy. The new product feature is also improving productivity and yield.
"The FDETM is a major asset of the LTA platform for our customer, and Excico is committed to make this evoluate and improve in front of our customer requirements. Our technology is aligned with their latest roadmap and development"