Fab Solutions :

The LTA product platform offers a total solution adapted to today and tomorrow’s semiconductor fabrication constraints:

• The Highest Available Throughput for a Laser Anneal Solution, up to 100 wafers/hour depending on specific process

• A Modular and Flexible Architecture that can be adapted to specific fab layout constraints with laser module in sub-fab floor or on main fab floor.

• Process Monitoring & control solutions

The Advanced Process Monitoring & Control (APMC^TM) feature offers in-situ, real time monitoring of the annealing process, enabling process control and yield optimization.

• Wafer handling adapted to each applications:

-  Thin Wafer down to 50 µm thickness

-  300 mm FOUPS

-  200mm open cassette