Excico enables BSI CMOS image sensor production ramp up

Excico received a repeat Purchase Order in October 2010 for its LTA15CE advanced annealing production platform from a major Asian CMOS Imaging Sensor manufacturer. The 300mm equipement supplied by Excico give the unique benefit to CIS manufacturers to produce Backside CMOS imaging sensor (BSI-CIS) at lower cost while reaching high performance and yield thanks to its unique patented Full Die Exposure (FDE) process