Application & Processes

Excico Laser Annealing
The ultra-low thermal budget processes enabled by the Excico annealing equipments are covering a wide range of semiconductor markets for present and future device generations

The applications and processes covered by the Excico Ultra-fast Annealing technology include:

· Present Front End of Line processes that are today realized through classical annealing but where Excico bring important and sizable Parametric Yield as well as Line Yield improvement.

Excico LTA melt-mediated process enables:

o Only backside dopant activation technology for thin devices while front side remains at room temperature

o Combinatorial processing for reduced development time and costs

o Highest reported activation level of electrical dopant in semiconductors

o The highest temperature gradient preserving buried structures while ensuring a defect-free and stress-free recrystallization

o Full device processing without stitching in one shot

· Short Future semiconductor processes where annealing needs to take place in ultra-thin layers without affecting underlying structures (3D integration) or exotic substrates (flexible substrate, ultrathin wafers…) at both Front End of Line and Back End of Line

Excico LTA enables to overcome major process integration issue of future device designs:

o Option on Core devices

o Flexible Electronics and Photovoltaics

o Laser Lift Off applications

o New materials (high k, porous materials, contacts,…)